Application of microforging to SiCN MEMS fabrication

    Authors

    Y. P. Liu; L. A. Liew; R. L. Luo; L. N. An; M. L. Dunn; V. M. Bright; J. W. Daily;R. Raj

    Comments

    Authors: contact us about adding a copy of your work at STARS@ucf.edu

    Abbreviated Journal Title

    Sens. Actuator A-Phys.

    Keywords

    SiCN; MEMS; microcast; microforge; microform; ceramic; CERAMICS; Engineering, Electrical & Electronic; Instruments & Instrumentation

    Abstract

    Ceramics and polymers are attractive candidate materials for MEMS applications because of the wide range of properties that can be obtained, and the promise of improved performance as compared to the existing materials set for MEMS. A challenge in the fabrication of ceramic MEMS is prohibiting cracking that can occur during processing. For example, this is significant in the development of a microcasting fabrication technique from a polymer precursor for silicon carbonitride (SiCN) MEMS. In this case, shrinkage mismatch between the SiCN structure and the microfabricated mold during thermal processes leads to significant stresses that can crack the ceramic structure. Here, we propose an approach to overcome this problem that relies on demolding prior to the large shrinkage mismatch thermal processes, which itself is a nontrivial challenge. To this end, we propose and describe a microforging process that facilitates demolding and show representative results for numerous SiCN ceramic microstructures. (C) 2002 Elsevier Science B.V. All rights reserved.

    Journal Title

    Sensors and Actuators a-Physical

    Volume

    95

    Issue/Number

    2-3

    Publication Date

    1-1-2002

    Document Type

    Article; Proceedings Paper

    Language

    English

    First Page

    143

    Last Page

    151

    WOS Identifier

    WOS:000173177600009

    ISSN

    0924-4247

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