Title

Application of microforging to SiCN MEMS fabrication

Authors

Authors

Y. P. Liu; L. A. Liew; R. L. Luo; L. N. An; M. L. Dunn; V. M. Bright; J. W. Daily;R. Raj

Comments

Authors: contact us about adding a copy of your work at STARS@ucf.edu

Abbreviated Journal Title

Sens. Actuator A-Phys.

Keywords

SiCN; MEMS; microcast; microforge; microform; ceramic; CERAMICS; Engineering, Electrical & Electronic; Instruments & Instrumentation

Abstract

Ceramics and polymers are attractive candidate materials for MEMS applications because of the wide range of properties that can be obtained, and the promise of improved performance as compared to the existing materials set for MEMS. A challenge in the fabrication of ceramic MEMS is prohibiting cracking that can occur during processing. For example, this is significant in the development of a microcasting fabrication technique from a polymer precursor for silicon carbonitride (SiCN) MEMS. In this case, shrinkage mismatch between the SiCN structure and the microfabricated mold during thermal processes leads to significant stresses that can crack the ceramic structure. Here, we propose an approach to overcome this problem that relies on demolding prior to the large shrinkage mismatch thermal processes, which itself is a nontrivial challenge. To this end, we propose and describe a microforging process that facilitates demolding and show representative results for numerous SiCN ceramic microstructures. (C) 2002 Elsevier Science B.V. All rights reserved.

Journal Title

Sensors and Actuators a-Physical

Volume

95

Issue/Number

2-3

Publication Date

1-1-2002

Document Type

Article; Proceedings Paper

Language

English

First Page

143

Last Page

151

WOS Identifier

WOS:000173177600009

ISSN

0924-4247

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