Applicability of dynamic mechanical analysis for CMP polyurethane pad studies

    Authors

    H. Lu; Y. Obeng;K. A. Richardson

    Comments

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    Abbreviated Journal Title

    Mater. Charact.

    Keywords

    dynamic mechanical analysis; chemical-mechanical polishing; polyurethane; Materials Science, Multidisciplinary; Metallurgy & Metallurgical; Engineering; Materials Science, Characterization & Testing

    Abstract

    Dynamic mechanical analysis (DMA) was used to obtain dynamic moduli of a standard industrial polishing pad before and after chemical-mechanical polishing (CMP). The multiple transitions found in the tan delta curve of the stacked pad are associated with the components present in the stacked pad. The effective dynamic storage modulus of an IC1000/Suba IV stacked pad showed a correlation with the elasticity of the individual pad materials. These dynamic studies provide evidence that in situ mechanical modifications play a greater role in pad material degradation than those due to chemical modifications. (C) 2003 Published by Elsevier Science Inc.

    Journal Title

    Materials Characterization

    Volume

    49

    Issue/Number

    2

    Publication Date

    1-1-2002

    Document Type

    Article

    Language

    English

    First Page

    177

    Last Page

    186

    WOS Identifier

    WOS:000181580700012

    ISSN

    1044-5803

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