RF SAW filter package design for wireless communications

    Authors

    C. Finch; X. M. Yang; T. X. Wu;B. Abbott

    Abbreviated Journal Title

    Microw. Opt. Technol. Lett.

    Keywords

    RF SAW filter; electronic packaging; finite-element method; Engineering, Electrical & Electronic; Optics

    Abstract

    This paper describes a new method to design a ceramic chip and wire package for an RF SAW filter. Both the solid model of the package and bond wires are included in the full-wave analysis. A novel port configuration is used in finite-element simulation. Agreement between measurement and simulation is found to be excellent. (C) 2003 Wiley Periodicals, Inc.

    Journal Title

    Microwave and Optical Technology Letters

    Volume

    39

    Issue/Number

    5

    Publication Date

    1-1-2003

    Document Type

    Article

    Language

    English

    First Page

    399

    Last Page

    401

    WOS Identifier

    WOS:000186081400016

    ISSN

    0895-2477

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