Polishing studies on tantalum barrier layer in copper chemical mechanical planarization

Keywords

Copper; Grinding and polishing; Impedance spectroscopy; Tantalum

Notes

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Graduation Date

2003

Advisor

Sundaram, Kalpathy B.

Degree

Master of Science (M.S.)

College

College of Engineering

Department

Electrical Engineering and Computer Science

Format

Print

Pages

97 p.

Language

English

Length of Campus-only Access

None

Access Status

Masters Thesis (Open Access)

Subjects

Dissertations, Academic -- Engineering; Engineering -- Dissertations, Academic

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