Mechanistic aspects of electroless copper plating on ceramic substrates for EMI shielding applications/

Keywords

Copper, Copper plating, Plating

Notes

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Graduation Date

Fall 2000

Advisor

Seal, Sudipta

Degree

Master of Science (M.S.)

College

College of Engineering

Department

Mechanical, Materials, and Aerospace Engineering

Degree Program

Materials Science and Engineering

Format

Print

Language

English

Length of Campus-only Access

None

Access Status

Masters Thesis (Open Access)

Subjects

Dissertations, Academic -- Engineering; Engineering -- Dissertations, Academic

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