Title

Chemical-Mechanical Planarization Advances With The Times

Abstract

Chemical-mechanical planarization, a technique which was developed by IBM researchers for the production of extremely flat surfaces on integrated circuit wafers, is progressing with time. The problems including dishing effect and erosion due to pattern density variations across the die is minimized by using pre-CMP procedures. The advanced CMP tools uses robots to handle wafers and process several wafers at a time. Wafer carriers with advanced technology and with variable back-pressure distribution reduces within-wafer nonuniformity to provide accurate and sophisticated slurry system. The interconnect metal aluminum in the modern CMPs has been replaced by copper for the reduction of interconnect resistance. All these development in the CMP has led them for various uses such as in the field of microelectromechanical system (MEMS) fabrication. There are expectations that CMP process will evolve itself into new directions as it is searching for the alternatives for silicon.

Publication Date

1-1-2008

Publication Title

IEEE Potentials

Volume

27

Issue

1

Number of Pages

26-30

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/MPOT.2007.911258

Socpus ID

38349061006 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/38349061006

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