Title

Modeling Of Time-Dependent Dielectric Breakdown In Copper Metallization

Keywords

Copper diffusion; Copper interconnect; Dielectric breakdown; E model; Time-dependent dielectric breakdown (TDDB)

Abstract

Dielectric breakdown of copper interconnects has been studied. The general continuity equation on Cu+ diffusion and drift is investigated. An analytical model to predict the lifetime of time-dependent dielectric breakdown is developed. The model predictions agree well with the previously published experimental data at different electric fields and temperatures. Under an acceleration stress condition, the lifetime is proportional to electric field exponentially and consistent with the E model.

Publication Date

6-1-2003

Publication Title

IEEE Transactions on Device and Materials Reliability

Volume

3

Issue

2

Number of Pages

26-30

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/TDMR.2003.811602

Socpus ID

3042806767 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/3042806767

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