Title

Surface-Modified Polymeric Pads For Enhanced Performance During Chemical Mechanical Planarization

Keywords

ASP; CMP; FTIR; Nanoindentation; PECVD; Polyurethane; TEOS; XPS

Abstract

The chemical mechanical planarization (CMP) process occurs at an atomic level at the slurry/wafer interface and hence slurries and polishing pads play a critical role in their successful implementation. Polyurethane is a commonly used polymer in the manufacturing of CMP pads. These pads are incompatible with some chemicals present in the CMP slurries, such as hydrogen peroxide. To overcome these problems, Psiloquest has developed new Application Specific Pads (ASP). Surface of such pads has been modified by depositing a thin film of tetraethyl orthosilicate using plasma-enhanced chemical vapor deposition (PECVD) process. In the present study, mechanical properties of such coated pads have been investigated using nanoindentation. The surface morphology and the chemistry of the ASP were studied using scanning electron microcopy, X-ray photoelectron spectroscopy, and Fourier transform infrared spectroscopy techniques. It was observed that mechanical and chemical properties of the pad top surface are a function of the PECVD coating time. Such PECVD-treated pads are found to be hydrophilic and do not require storage in aqueous media during the not-in-use period. The metal removal rate using such surface-modified polishing pads was found to increase linearly with the PECVD coating time. © 2005 Elsevier B.V. All rights reserved.

Publication Date

7-1-2005

Publication Title

Thin Solid Films

Volume

483

Issue

1-2

Number of Pages

261-269

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1016/j.tsf.2004.12.063

Socpus ID

18844428301 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/18844428301

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