Title

Elucidating Cu-Glycine And Bta Complexations In Cu-Cmp Using Sims And Xps

Abstract

The role of oxidants, complexing agents, and inhibitors in copper surface modification during Cu-chemical mechanical planarization (CMP) process was studied using secondary ion mass spectroscopy (SIMS) and X-ray photoelectron spectroscopy (XPS). The changes in the Cu surface chemistry in the presence of hydrogen peroxide, glycine, and benzotriazole (BTA) were investigated, with a special attention to the effect of pH, Cu-glycine-, and Cu-BTA-complex formations. The present investigation corroborates the earlier reported results of an increased copper dissolution in solution containing glycine and hydrogen peroxide, and a decreased removal rate of copper in the presence of benzotriazole due to the formation of a Cu-BTA polymeric film. © 2005 The Electrochemical Society. All rights reserved.

Publication Date

5-17-2005

Publication Title

Electrochemical and Solid-State Letters

Volume

8

Issue

4

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1149/1.1869112

Socpus ID

18144412445 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/18144412445

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