Title

Low Stressed High-Aspect-Ratio Ultra-Thick Su-8 Uv-Liga Process For The Fabrication Of A Micro Heat Exchanger

Keywords

Adhesion; Cryo temperature; Electroforming; Micro heat exchanger; SU-8; UV-LIGA

Abstract

SU-8 is an ultra-thick negative photoresist with low optical absorption in the near UV range, which makes it an ideal material for generating thick molds for electroforming as well as a structural material for MEMS devices. However, the MEMS fabrication of using SU-8 is largely limited by its well-known poor adhesion to metallic layers as well as the high internal stress induced after baking. In this paper, an optimized process for fabricating ultra-thick low stressed SU-8 mold is developed and good adhesion between SU-8 and metals is obtained by applying a newly developed material, Omnicoat from Microchem Inc. A laminated (sandwiched) micro heat exchanger has been fabricated using the developed process in which sandwiched microchannels (one layer of Ni and one layer of SU-8) has been fabricated using the patterned SU-8 and nickel electroforming process. Test results show that the micro structure fabricated can stand at cryo temperature (77K) without damages such as cracks or delamination.

Publication Date

5-10-2004

Publication Title

Proceedings of SPIE - The International Society for Optical Engineering

Volume

5344

Number of Pages

147-154

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1117/12.524608

Socpus ID

2142815401 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/2142815401

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