Title

Use Of Laser(S) In The Process Of Superplastic Forming And Diffusion Bonding

Keywords

Ceramic Dies; Contamination-Free Forming; Cost-Lowering; Diffusion Bonding Titanium &; Aluminium; Factory Simulation; Laser Heating; Process Integration

Abstract

Superplastic Forming and Diffusion Bonding (SPF/DB) has permitted the manufacture of some of the lightest, strongest, corrosion resistant, complex, and yet often elegant structures ever to be produced. For the last 30 years, all such components have been made by some form of high thermal-mass, isothermal method of production using conventional equipment, such as hot platen presses or furnaces. However, if laser(s) could be used just to heat the material to be superplastically formed, this could provide a novel, low thermal-mass, means of production which could, relatively easily, be integrated into a laser based manufacturing centre. In this paper, a concept is described of how a laser based manufacturing centre, comprised of a number of individual process cells, together with integrated pre and post SPF/DB operations, would work and the benefits that would result. The concept is based on four considerations. Firstly, that it is essential to heat the material directly and quickly. Secondly, the environment must be completely inert so that there is no contamination of components. Thirdly, the complete process of diffusion bonding must only entail the use of laser(s). Lastly, established laser activities such as cutting, welding, hole drilling or trepanning and the removal of surplus material, must be integrated into the process. In addition, the envisaged cells need to be modular in concept so industry can acquire capital plant progressively, thereby spreading the cost over time.

Publication Date

1-1-2004

Publication Title

Materials Science Forum

Volume

447-448

Number of Pages

533-540

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.4028/www.scientific.net/msf.447-448.533

Socpus ID

3142783023 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/3142783023

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