Title

Co2 Laser Drilling Of Microvias Using Diffractive Optics Techniques; I Mathematical Modeling

Keywords

Laser drilling; Modeling; Organic packaging; Plasma; Polymers

Abstract

This paper is the first of three parts summarizing the research to use diffractive optics at the CO2 laser wavelength to drill microvias in the 40-50 urn range for organic packaging applications. This first part mainly focuses on mathematical modeling of the drilling process, which is used to define the characteristics of the laser beam necessary to achieve the required geometry of the microvias. These laser characteristics and the properties of the incoming laser beam of the CO2 laser system are then used to provide a deterministic approach for obtaining performance data for the diffractive optics design. The targeted optics are designed based on the modeling result and are then integrated into a prototype system to execute the drilling operation. The model is based on the conversion of optical energy into thermal energy due to laser-substrate interaction, propagation of thermal energy in the substrate, thermal as well as radiation damage threshold of the substrate and other important laser drilling parameters (e.g., fluence, temporal and spatial characteristics of the beam, residue at the via bottom). Copyright © 2005 by ASME.

Publication Date

2-23-2006

Publication Title

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volume

PART C

Number of Pages

1903-1909

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

Socpus ID

32844470243 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/32844470243

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