Title

Reliability Study Of Au-In Transient Liquid Phase Bonding For Sic Power Semiconductor Packaging

Abstract

Transient liquid phase (TLP) bonding is a promising advanced die-attach technique for wide-bandgap power semiconductor and high-temperature packaging. TLP bonding advances modern soldering techniques by raising the melting point to over 500°C without detrimental high-lead materials. The bond also has greater reliability and rigidity due in part to a bonding temperature of 200°C that drastically lowers the peak bond stresses. Furthermore, the thermal conductivity is fractionally increased 67 % while the bond thickness is substantially reduced, lowering the thermal resistance by an order of magnitude or more. It is observed that Au-In TLP bonds exude excellent electrical reliability against thermal cycling degradation if designed properly as experimentally confirmed in this work. © 2011 IEEE.

Publication Date

12-1-2011

Publication Title

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Number of Pages

260-263

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/ISPSD.2011.5890840

Socpus ID

84870534843 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84870534843

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