Title
Adaptive Gate Bias For Power Amplifier Temperature Compensation
Keywords
Bias circuit; hot electron; mixed-mode simulation; output power; power amplifier (PA); power-added efficiency; self-heating; temperature compensation
Abstract
Mixed-mode device and circuit simulation is used to examine device self-heating during power amplifier (PA) transient response. Lattice temperature increases with time and eventually saturates beyond the thermal time constant. Temperature variation on the effect of PA performances has been modeled and analyzed. Different gate biasing schemes that reduce the temperature drift of PA output power and power-added efficiency are evaluated. A simple adaptive gate bias technique effectively provides temperature compensation of PA performances over a wide range of temperatures. © 2010 IEEE.
Publication Date
9-1-2011
Publication Title
IEEE Transactions on Device and Materials Reliability
Volume
11
Issue
3
Number of Pages
442-449
Document Type
Article
Personal Identifier
scopus
DOI Link
https://doi.org/10.1109/TDMR.2011.2160264
Copyright Status
Unknown
Socpus ID
80052610426 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/80052610426
STARS Citation
Chen, Shuyu and Yuan, Jiann Shiun, "Adaptive Gate Bias For Power Amplifier Temperature Compensation" (2011). Scopus Export 2010-2014. 2782.
https://stars.library.ucf.edu/scopus2010/2782