Title
Grain Boundary And Surface Scattering In Interconnect Metals
Abstract
This work addresses the classical size effect in interconnect metals and presents the theoretical background and quantification of the contributions of grain boundary and surface scattering to the observed resistivity increase in Cu. The results of experimental studies of Cu films and lines are reviewed. The extent to which the experimental data supports the theoretically expected interactions between surface and grain boundary scattering mechanisms will also be discussed. © 2013 IEEE.
Publication Date
11-4-2013
Publication Title
Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
Number of Pages
-
Document Type
Article; Proceedings Paper
Personal Identifier
scopus
DOI Link
https://doi.org/10.1109/IITC.2013.6615565
Copyright Status
Unknown
Socpus ID
84886666851 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/84886666851
STARS Citation
Coffey, Kevin R.; Barmak, Katayun; Sun, Tik; Warren, Andrew P.; and Yao, Bo, "Grain Boundary And Surface Scattering In Interconnect Metals" (2013). Scopus Export 2010-2014. 6442.
https://stars.library.ucf.edu/scopus2010/6442