Title

Grain Boundary And Surface Scattering In Interconnect Metals

Abstract

This work addresses the classical size effect in interconnect metals and presents the theoretical background and quantification of the contributions of grain boundary and surface scattering to the observed resistivity increase in Cu. The results of experimental studies of Cu films and lines are reviewed. The extent to which the experimental data supports the theoretically expected interactions between surface and grain boundary scattering mechanisms will also be discussed. © 2013 IEEE.

Publication Date

11-4-2013

Publication Title

Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

Number of Pages

-

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/IITC.2013.6615565

Socpus ID

84886666851 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84886666851

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