Title

Electron Scattering In Metallic Thin Films

Keywords

Classical size effect; Resistivity; Scattering; Size effect; Thin film conductivity

Abstract

This chapter describes the role of grain boundaries and surfaces in the resistivity of metallic thin films, focusing on the increase in resistivity as the characteristic dimensions (e.g., grain size and film thickness) of the metal are reduced, a phenomenon known as the classical size effect. The electrical conduction in bulk metals is briefly described using Boltzmann's transport equation. Extensions of that understanding to include the additional scattering from surfaces and grain boundaries are developed. Several quantitative models of classical size effect are reviewed based on differing physical assumptions and quantitative comparisons of experimental data to the models are made to provide an increased physical understanding. © 2014 Woodhead Publishing Limited. All rights reserved.

Publication Date

1-1-2013

Publication Title

Metallic Films for Electronic, Optical and Magnetic Applications: Structure, Processing and Properties

Number of Pages

422-453

Document Type

Article; Book Chapter

Personal Identifier

scopus

DOI Link

https://doi.org/10.1533/9780857096296.2.422

Socpus ID

84904028056 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84904028056

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