Title

Backside Surface Machining Of Silicon Wafers Using A Nanosecond Tm: Fiber Mopa System

Abstract

We report on selective machining of the back surface machining of double-side polished silicon wafers, using a high peak power nanosecond Tm:fiber master oscillator power amplifier with a photonic crystal fiber based power amplifier. © OSA 2013.

Publication Date

11-18-2013

Publication Title

CLEO: Science and Innovations, CLEO_SI 2013

Number of Pages

-

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

Socpus ID

84887454655 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84887454655

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