Title
Backside Surface Machining Of Silicon Wafers Using A Nanosecond Tm: Fiber Mopa System
Abstract
We report on selective machining of the back surface machining of double-side polished silicon wafers, using a high peak power nanosecond Tm:fiber master oscillator power amplifier with a photonic crystal fiber based power amplifier. © OSA 2013.
Publication Date
11-21-2013
Publication Title
CLEO: QELS_Fundamental Science, CLEO:QELS FS 2013
Number of Pages
-
Document Type
Article; Proceedings Paper
Personal Identifier
scopus
Copyright Status
Unknown
Socpus ID
84887703447 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/84887703447
STARS Citation
Shah, Lawrence; Bonhoff, Tobias; El-Sherif, Ashraf F.; Kadwani, Pankaj; and Gebhardt, Martin, "Backside Surface Machining Of Silicon Wafers Using A Nanosecond Tm: Fiber Mopa System" (2013). Scopus Export 2010-2014. 6537.
https://stars.library.ucf.edu/scopus2010/6537