Title

Hemispherical Image Sensor Development For Wide Fov Imaging

Abstract

Curved image sensors offer a new degree of freedom in optical system design that promise low-cost, small-volume solutions for wide field-of-view imaging. Stretchable polymer backplanes can provide the high-density of interconnects and tolerate the large deformations needed to transform planar, wafer-based image sensors into shapes with large nonzero Gaussian curvature. Here we demonstrate a thermoformable backplane based on glycolated polyethylene terephthalate (PETg) that can be deformed to a 98° spherical cap with 0.5" radius. We introduce a process to integrate such backplanes with a CMOS image sensor and release the circuit from the wafer to form a monolithically integrated image sensor that can be thermoformed to the desired shape.

Publication Date

1-1-2018

Publication Title

Proceedings of SPIE - The International Society for Optical Engineering

Volume

10656

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1117/12.2305051

Socpus ID

85050995826 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/85050995826

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