Applicability of dynamic mechanical analysis for CMP polyurethane pad studies
Abbreviated Journal Title
dynamic mechanical analysis; chemical-mechanical polishing; polyurethane; Materials Science, Multidisciplinary; Metallurgy & Metallurgical; Engineering; Materials Science, Characterization & Testing
Dynamic mechanical analysis (DMA) was used to obtain dynamic moduli of a standard industrial polishing pad before and after chemical-mechanical polishing (CMP). The multiple transitions found in the tan delta curve of the stacked pad are associated with the components present in the stacked pad. The effective dynamic storage modulus of an IC1000/Suba IV stacked pad showed a correlation with the elasticity of the individual pad materials. These dynamic studies provide evidence that in situ mechanical modifications play a greater role in pad material degradation than those due to chemical modifications. (C) 2003 Published by Elsevier Science Inc.
"Applicability of dynamic mechanical analysis for CMP polyurethane pad studies" (2002). Faculty Bibliography 2000s. 3338.