Keywords

Fabrication, Cryogenic, Photolithography, Photoresist, Wet Etching, Deep Reactive Ion Etching, Kapton, Polyamide, Profilometer

Abstract

This study concentrates on two of the main processes involved in the fabrication of electrostatic valve assembly, thick resist photolithography and wet chemical etching of a polyamide film. The electrostatic valve has different orifice diameters of 25, 50, 75 and 100 µm. These orifice holes are to be etched in the silicon wafer with deep reactive ion etching. The photolithography process is developed to build a mask of 15 µm thick resist pattern on silicon wafer. This photo layer acts as a mask for deep reactive ion etching. Wet chemical etching process is developed to etch kapton polyamide film. This etched film is used as a stand off, gap between two electrodes of the electrostatic valve assembly. The criterion is to develop the processed using standard industry tools. Pre post etch effects, such as, surface roughness, etching pattern, critical dimensions on the samples are measured with Veeco profilometer.

Notes

If this is your thesis or dissertation, and want to learn how to access it or for more information about readership statistics, contact us at STARS@ucf.edu

Graduation Date

2007

Semester

Fall

Advisor

Sundaram, Kalpathy B.

Degree

Master of Science (M.S.)

College

College of Engineering and Computer Science

Degree Program

Electrical Engineering

Format

application/pdf

Identifier

CFE0001828

URL

http://purl.fcla.edu/fcla/etd/CFE0001828

Language

English

Release Date

December 2007

Length of Campus-only Access

None

Access Status

Masters Thesis (Open Access)

Download

Share

COinS