Abstract
Experimental investigations and numerical predictions of steady state microdroplet evaporation experiments are presented. Steady state droplet evaporation experiments are conducted to understand (1) Droplet contact line influence on evaporation rate efficiency, (2) Droplet contact angle correlation to evaporation rate and (3) Substrate cooling. Experiments are performed on a polymer substrate with a moat like trench (laser patterned) to control droplet contact line dynamics. A bottom-up methodology is implemented for droplet formation on the patterned substrate. Droplet evaporation rates on substrate temperatures 22°C≤ ∆TSubstrate ≤75°C and contact angles 80°≤ Θ ≤110° are measured. For a pinned microdroplet (CCR), volumetric infuse rate influences droplet contact angle. Results illustrate droplet contact line impact on evaporation rate. Moreover, these results coincide with previously published results and affirm that evaporation rate efficiency reduces with contact line depinning. Additionally, from all the analyzed experimental cases, evaporation rate scales proportional to the microdroplet contact angle (i.e. ˙mLG ∝ θ). In conclusion, these experiments shed new light on steady state evaporation of a microdroplet and its corresponding observations. Vital research findings can be used to enhance heat dissipation from tiny surfaces.
Notes
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Graduation Date
2015
Semester
Summer
Advisor
Putnam, Shawn
Degree
Master of Science in Mechanical Engineering (M.S.M.E.)
College
College of Engineering and Computer Science
Department
Mechanical and Aerospace Engineering
Degree Program
Mechanical Engineering; Thermo-Fluids
Format
application/pdf
Identifier
CFE0006235
URL
http://purl.fcla.edu/fcla/etd/CFE0006235
Language
English
Release Date
February 2016
Length of Campus-only Access
None
Access Status
Masters Thesis (Open Access)
STARS Citation
Voota, Harish, "Analysis of steady state micro-droplet evaporation to enhance heat dissipation from tiny surfaces." (2015). Electronic Theses and Dissertations. 5035.
https://stars.library.ucf.edu/etd/5035