Keywords
semiconductors, MEMS, electronics, reliability, space, materials
Abstract
The purpose of this study is to analyze aluminum nitride (AlN) micro-electromechanical systems (MEMS) resonators designed for extreme-environment applications. The devices of study are Lamb wave, piezoelectric resonators designed and fabricated using conventional semiconductor manufacturing processes and operating around various frequencies in the megahertz range. The purpose of this study is to advance understanding of MEMS devices in extreme-temperature and radiated environments for outer-space applications.
Devices were tested under vacuum at temperatures ranging from room temperature (~21°C) to 800°C. Under these conditions, the device was measured both as a resonator and in an oscillator circuit. Results show that the resonant frequency decreases only slightly with increasing temperature and that the insertion loss remains largely stable. In the oscillator circuit, phase noise increases with temperature, primarily due to increased thermal noise. Device performance was also experimentally tested and characterized under X-ray irradiation. Changes in device characteristics and recovery from radiation exposure are currently under study.
This study shows how well aluminum nitride lamb wave resonators perform under extreme environmental stresses, both on their own and as oscillators. Results show very promising applications for frequency control in outer space using AlN MEMS devices.
Thesis Completion Year
2026
Thesis Completion Semester
Spring
Thesis Chair
Lee, Jaesung
College
College of Engineering and Computer Science
Department
Electrical and Computer Engineering
Thesis Discipline
Electrical Engineering
Language
English
Access Status
Open Access
Length of Campus Access
None
Campus Location
Orlando (Main) Campus
STARS Citation
Taggart, Joshua, "The Design and Analysis of Robust MEMS Devices for Extreme Space Environments" (2026). Honors Undergraduate Theses. 627.
https://stars.library.ucf.edu/hut2024/627
Included in
Electronic Devices and Semiconductor Manufacturing Commons, Semiconductor and Optical Materials Commons, Signal Processing Commons
Accessibility Statement
This item was created or digitized prior to April 24, 2027, or is a reproduction of legacy media created before that date. It is preserved in its original, unmodified state specifically for research, reference, or historical recordkeeping. In accordance with the ADA Title II Final Rule, the University Libraries provides accessible versions of archival materials upon request. To request an accommodation for this item, please submit an accessibility request form.