Title

Modelling Of Coupled Interconnect Lines For Integrated Circuits

Abstract

A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal coupling is presented in terms of interconnect width, substrate thickness, interconnect line spacing, and frequency. Picosecond photoconductor based measurements of coupled transmission lines on the integrated circuit support the even and odd mode signal transmission simulation results. SPICE circuit simulation is used to demonstrate the model utility and explore the sensitivity of the self- and mutual capacitances and inductances in signal crosstalk. © 1991 Taylor & Francis Ltd.

Publication Date

1-1-1991

Publication Title

International Journal of Electronics

Volume

70

Issue

4

Number of Pages

751-764

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1080/00207219108921325

Socpus ID

0026136070 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/0026136070

This document is currently not available here.

Share

COinS