Title

Electrical And Temperature Stress Effects On Class-Ab Power Amplifier Performances

Keywords

Class-AB power amplifier (PA); Conduction angle; Power efficiency; RF simulation; Third-order intercept point

Abstract

Normalized degradations of drain efficiency and output power as a function of conduction angle, maximum drain current, and maximum output voltage are modeled. Good agreement between the model predictions and Cadence radio-frequency simulation results is obtained. The output power and efficiency of class-AB power amplifiers (PAs) degrade with channel hot electron stress due to reduced conduction angle, drain current, and output voltage. The degradation is enhanced at high temperature. In addition, the PA third-order input intercept point and adjacent channel power ratio all decrease with stress. © 2007 IEEE.

Publication Date

6-1-2007

Publication Title

IEEE Transactions on Electron Devices

Volume

54

Issue

6

Number of Pages

1346-1350

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/TED.2007.896601

Socpus ID

34249889581 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/34249889581

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