Title
Thermal Reliability Of Vco Using Ingap/Gaas Hbts
Abstract
Degradations of InGaP/GaAs heterojunction bipolar transistor (HBT) collector current and base current subjected to cumulative long-term junction temperature stress are examined experimentally. The aged SPICE model parameters as a function of stress time are extracted from the measurement data. The VCO phase noise, tuning range, and output amplitude are studied in circuit simulation. The phase noise increases, tuning range and output amplitude decrease with increasing junction temperature. © 2011 Elsevier Ltd. All rights reserved.
Publication Date
12-1-2011
Publication Title
Microelectronics Reliability
Volume
51
Issue
12
Number of Pages
2147-2152
Document Type
Article
Personal Identifier
scopus
DOI Link
https://doi.org/10.1016/j.microrel.2011.07.019
Copyright Status
Unknown
Socpus ID
81855161590 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/81855161590
STARS Citation
Liu, Xiang; Yuan, Jiann Shiun; and Liou, Juin J., "Thermal Reliability Of Vco Using Ingap/Gaas Hbts" (2011). Scopus Export 2010-2014. 2348.
https://stars.library.ucf.edu/scopus2010/2348